The that will power the is expected to improve performance and speed further and more importantly will focus on power efficiency to better the battery life.
Having said that the A13 chipset will be different from its predecessor as TMSC “would be adopting extreme ultraviolet lithography for the first time” as reported by Digitimes earlier.
The A13 chipset will also enable advanced . This chipset will be fabricated using a 7 nanometer process. To recall, the , which powers the latest lineup of iPhones — iPhone XS, and — is also based on 7nm FinFET process.
With the Apple gearing up to launch the 2019 later this year, its partner Taiwan Semiconductor Manufacturing Company (TSMC) has started the production of the next generation chipset that will power these iPhones.
The 2019 iPhones are expected to be called iPhone 11 (eleven) and 11 Max. Apple will most likely launch another affordable alternative like the iPhone XR this year too.
The 3D cameras integrate ‘Time of Flight’ technology which tracks the subject and provides better focus and details.
Talking about the iPhone 11 and 11 Max, popular leakster Slashleaks recently had shared an image of the case manufacturing dummies of both the devices.
While the dummies did not reveal much details of the next iPhones, it did gave the world an idea about the dimensions along with a square camera module at the back housing a triple lens setup.
The front images of the dummies revealed that Apple would most likely continue with the same notch design with place for two sensors on either side of the speaker hole, one of which will be the front camera.
Apple is reportedly working with Sony to add a 3D camera at the back of the upcoming iPhones. Apple could also use the same 3D camera on the front as well to improve Face ID.